Sony Unveils Manufacturing Process of DRAM-embedded Image Sensor (1)

The Sony group (Sony Semiconductor Solutions Corp and Sony Semiconductor Manufacturing Corp) made an announcement about the manufacturing process of a CMOS image sensor that is made by stacking layers including a DRAM layer and making them into a chip at IEDM 2017.

Sony Unveils Manufacturing Process of DRAM-embedded Image Sensor (1)

The Sony group (Sony Semiconductor Solutions Corp and Sony Semiconductor Manufacturing Corp) made an announcement about the manufacturing process of a CMOS image sensor that is made by stacking ...

Fri 26 Jan 18 from Tech-On

Sony Unveils Manufacturing Process of DRAM-embedded Image Sensor (2)

Second, the DRAM wafer and the logic circuit wafer are joined together, and the thickness of the DRAM wafer is reduced to 3μm, which is less than 1/200 of the original thickness.

Fri 26 Jan 18 from Tech-On

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